Event
Packaging Workshop
Wednesday, January 30, 2013
L’Atelier scientifique sur les composants et microsystèmes: évolution des techniques de packaging et d’interconnexion.
The ISS Program would like to announce a special 1-day workshop on Device Packaging to be presented Wednesday January 30, 2013 in collaboration with Le laboratoire Nanotechnologies Nanosystèmes (LN2), Le Centre de Collaboration MiQro Innovation (C2MI) and NanoQuébec.
“L’Atelier scientifique sur les composants et microsystèmes: évolution des techniques de packaging et d’interconnexion” will be presented at the C2MI in Bromont, QC from 8:30 am to 6:00pm.
Registration and sign up for transport from Â鶹AV (downtown Montreal) to C2MI can be found at www.mcgill.ca/miam/iss/courses/packaging. Space is limited; please sign up now to reserve your space.
Contact Information
Contact:
Rowena Franklin
Organization:
Â鶹AV
Email:
Administrator-MIAM.engineering [at] mcgill.ca
Office Phone:
514-398-8718
Category:
Attachments:
Thu, 01/03/2013 - 16:39
Source Site: