Â鶹AV

Would you like to receive the MIAM newsletter and be notified of future MIAM events?

Event

Seminar and hands on demo: Heidelberg Instrument

Thursday, May 26, 2022 13:00to17:00
Rutherford Physics Building Room 105, 3600 rue University, Montreal, QC, H3A 2T8, CA

Seminar and hands on demo: Heidelberg Instrument: Thermal scanning probe lithography technology (NanoFrazor-tSPL)Ìý

13:00 - 14:00: presentation, Q&A session

14:00 - 16:00: demonstration in cleanroom (everybody needs bunny suits provided by the lab, no shorts and open shoes)

Dear Nanotools Users,Ìý

Our Nanofrazor system will have a major upgrade this month. An Engineer from Heidelberg will give a presentation regarding their unique technology, new capabilities and process development on the system. Here it is the short list of the capabilities of the Nanofrazor, the highlighted parts are the new features after the upgrade.

ÌýAll existing nanotools users are welcomed and feel free to spread the message. If you are interested, please send me an email to confirm to your attendance.Ìý

Zhao Lu PhD

Manager

Â鶹AV Nanotools Micro, Nanofabrication Facility

Â鶹AV

Address: 3600 University, Montreal, Quebec, Canada

Tel: +1 514 3983310

Email: zhao.lu [at] mcgill.ca

Ìý

Main Features:Ìý

High-resolution

Easy patterning of nanostructures even with complex geometries; min. lateral features 15 nm, Vertical resolution 2 nm

Thermal Scanning Probe Lithography

New approach to nanopatterning enabling applications not otherwise feasible

Non-invasive Lithography

No damage from charged particles, no proximity effects, clean lift-off

Compatibility

With all standard pattern transfer methods: lift-off, etching, etc – knowledge resource and best practices available in our “Recipe Bookâ€

In-situ Imaging

Immediate control of patterned structures

Precise Overlay and Stitching

Markerless overlay and stitching accuracy 25 nm specified, sub-10 nm overlay shown

Unique Thermal Cantilevers

Integrated microheater and distance sensor; easy to exchange and economical

Laser Sublimation Module

High-throughput exposure of coarse structures in the same exposure step; 405 nm wavelength CW fiber laser

Back to top