Vue d'ensemble
Génie mécanique : Introduction to microelectromechanical systems (MEMS). Micromachining techniques (thin-film deposition; lithography; etching; bonding). Microscale mechanical behaviour (deformation and fracture; residual stresses; adhesion; experimental techniques). Materials- and process-selection. Process integration. Design of microdevice components to meet specified performance and reliability targets using realistic manufacturing processes.
Trimestres : Hiver 2016
Chargés de cours : Vengallatore, Srikar (Winter)
(3-0-6)
Prerequisite: Instructor's permission.